Recently, Hong Kong Monetary Authority (HKMA) initiated accepting applications for Digital Bond Grant Scheme (the Grant Scheme) to financially support digital bond issuers for the duration of three years. The Grant Scheme aims to encourage broader adoption of “tokenization technology” in capital markets and foster the development of digital securities markets in Hong Kong.

“Digital bond” is defined as a bond that utilizes distributed ledger technology (DLT) to digitally represent ownership, which may encompass legal titles and/or beneficial interests in the bond. Each eligible issuer, including its associates, may receive subsidies under the Grant Scheme for a maximum of two digital bond issuances.

The Grant Scheme subsidizes:

Eligibility Requirements

Half grant

It is available when the issuances meet the following basic requirements:

Full grant

For a Full Grant, in addition to the basic requirements, the issuance must meet additional requirements, including:

Eligible Expenses

The Grant Scheme subsidizes expenses related to the issuance of digital bonds, including:

Additionally, if the digital bond qualifies as a green, social, or sustainability bond, the following grant will be available:

How To Apply

Potential applicants may start with an “optional pre-application consultation” with the HKMA for preliminary feedback on their eligibility.

Formal applications must be submitted within three months of the bond’s issuance.

Conclusion

As tokenization of securities is expected to be more popular this year and HKMA is providing flexible subsidiary programs with options of Half Grant or Full Grant, foreign companies as well as Hong Kong companies may wish to take advantage of the subsidy programs to issue digital bonds and save their issuance costs.

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